-. Application wafer : 6”,8” or 8”, 12”

-. Wafer thickness : 200um <= (8”)

                                330um <= (12”)

-. Wafer warpage : 4mm>=

-. Tape wide : 300mm,  400mm

-. Application tape : normal & uv tape

-. UPH : 45 wafer/hr(12”),

              50 wafer/hr(8”)

-. Main controller : PLC

-. Data & GUI : PC

-. Blade life time : 10,000 sheets

-. Ring frame stack : 100ea

-. Wafer center accuracy : +/-0.5mm

-. Pre-cut tape accuracy : +/-2mm

-. Chuck temp : 80℃ +/-5

-. Tape consumption : 30~40mm

-. Chuck surface cleaning function

-. Wafer angle : 0′, 90’, 180’, 270’

-. Tape tension controller