Company
Overview
Vision / Mission / Value
Organization
Our Location
Products
TAPE LAMINATION M/C Group
TAPE REMOVE M/C Group
Tape Mount M/C Group
OTHER M/C Group
New Packaging System
>
R&D
R&D Center
Certificate
Global Network
Contact
TAPE LAMINATION M/C
TAPE REMOVE M/C
Tape Mount M/C
OTHER M/C
New Packaging System
TAPE REMOVE M/C
Fully auto wafer remover
CUWRA-080 / CUWRA-120
This wafer remover system automates the removal of the protection tape after back grinding
TAPE REMOVE M/C
Fully auto ring frame remover
CURRA-080 / CURRA-120
This wafer remover system automates the removal of the protection tape after mounted wafer