THE OTHER M/C
UV irradiation system
CUUVA-080 / CUUVA-120
This system automates the removal of the protection fixing tape after dicing
THE OTHER M/C
Barcode print system
CUBPA-080 / CUBPA-120
Barcode label printing and attachment system, used after wafer ID is recognized via camera
THE OTHER M/C
Epoxy Mold Compound dispensing machine
Epoxy Mold Compound dispensing machine
This machine is designed to inspect wafer pattern or backside with wafer thickness or warpage Measurement.
THE OTHER M/C
Carrier debonder system
CUCMA-080 / CUCMA-120
This system is used to separate Metal carrier and Molded wafer after molding process.
THE OTHER M/C
Wafer Macro / Micro inspection machine
Wafer Macro / Micro inspection machine
This machine is designed to dispense Epoxy Mold Compound to metal carrier uniformly for mold chase process.
THE OTHER M/C
Wafer sorting system
CUWSA-080 / CUWSA-120
Wafer sorting system for packing & unpacking wafers
THE OTHER M/C
Spin cleaning system
CUSSC-080/CUSSC-120
Semi Spin cleaner to remove foreign materials on wafer surface after chip dicing process
THE OTHER M/C
MLF Film remover system
CUFRA-000
Film Remover on lead frame for QFN& SON etc package
THE OTHER M/C
Film attach system
CUFAA-000
Film attachment on lead frame for QFN& SON etc package
THE OTHER M/C
Manual UV irradiation
CUUVM-080 / CUUVM-120
This system automates the removal of the protection fixing tape during dicing