TAPE LAMINATION M/C
Fully auto BG tape lamination
CUWLA-080 / CUWLA-120
This lamination automates the application of protection tape on the surface of the semiconductor wafer during back grinding.
TAPE LAMINATION M/C
Fully auto LC tape lamination
CULCA-080 / CULCA-120
Fully auto LC tape lamination which laminates LC tape to wafer backside after back grinding
TAPE LAMINATION M/C
Auto Dry Film lamination
CUWLS-080(V) / CUWLS-120(V)
This laminator is use to attach photo or solder resist dry film on wafer active side to make wafer pattern. (Lamination method : Vacuum chamber lamination)
TAPE LAMINATION M/C
Semi auto BG tape lamination
CUWLS-080 / CUWLS-120
This lamination semi-automates the application of protection tape on the surface of the semiconductor wafer during back grinding