-. Application wafer : 6”,8” or 8”, 12”

-. Wafer thickness : 200um <= (8”)

                          330um <= (12”)

-. Wafer warpage : 4mm>=

-. Application tape : normal & uvtape

-. UPH : 50 wafer/hr(12”) 

           60 wafer/hr(8”)

    [based on remove speed 50mm/s UV time 5 sec]

-. Main controller : PLC

-. Data & GUI : PC

-. Wafer center accuracy : +/-0.5mm

-. Chuck temp : 60℃ +/-5

-. Peel bar temp : 180℃ +/-5

-. Peeling angle adjustable

-. Chuck surface cleaning function

-. Wafer angle : 0′, 90’, 180’, 270’

-. Tape tension controller

-. Vision alignment

-. Removal tape & heat seal used

-. Porous remove chuck

-. UV irradiation speciation ;

     1) 365 nm wave

     2) high pressure mercury lamp

     3) 100~1000 mj/㎠ dosage

     4) lamp life time 1000 hr

     5) ring blower

     6) UV sensor