THE OTHER M/C
Epoxy Mold Compound dispensing machine
Epoxy Mold Compound dispensing machine
This machine is designed to inspect wafer pattern or backside with wafer thickness or warpage Measurement.

-. Application carrier : 8” & 12”

-. Applicable cassette : FOUP, FOSB, DSC, Special

   cassette

-. Main system control : by PLC (Omron)

-. Data & GUI : by PC

-. Tower lamp : 4 colors(R, Y, G, B)

-. EMO : 2EA

-. Throughput : 80~100 wph/hr

-. Noise level : 80 dB