THE OTHER M/C
Carrier debonder system
CUCMA-080 / CUCMA-120
This system is used to separate Metal carrier and Molded wafer after molding process.

-. Application wafer : 300 mm

-. Applicable warpage : Less than 6mm

-. Warpage reduction : Less than 1~2 mm

-. UPH : 40 Wafer/hrwithout marking

-. UPH : 30 Wafer/hrwith marking

-. Heating : 30 seconds

-. Cooling :  20 seconds

-. Data & GUI : PC

-. Main control : by PLC (Omron)

-. Operation : 10 “ touch monitor

-. EMO : 4 ea

-. ESD : 1000Và100V (Within 5 seconds),

   Ion balance  ± 50V-.