THE OTHER M/C
Spin cleaning system
CUSSC-080/CUSSC-120
Semi Spin cleaner to remove foreign materials on wafer surface after chip dicing process

-. Application ring frame :  8 inch & 12 inch

-. Conversion : Changeable without any tool   

-. Wafer w/ring frame : Holding by vacuum

   and latch

-. Hot air supply : Controlled up to Max. 60˚C

-. Hot air spray time : Adjusted by Timer

-. Hot air moving speed : Control by AC Motor.

-. Chuck spin speed : by AC Servo motor

   Adjusted up to Max.3000RPM

-. Door locking check : by Switch

-. UPH : 50 lead frame/hr

-. Main controller : PLC (Omron)

-. Durable ball bearing & coupling

-. Noise level : Max. 80 Db

-. EMO : 2 ea

-. Tower lamp : 3 color(Red, Yellow, Green)

-. ESD : 1000v------> 100v, with 10 sec,

                            Ion balance : +/-5 volt