-. Application wafer : 6”,8” or 8”, 12”

-. Application tape : only precut tape

-. Tape width : Max 330 mm for 12 inch

-. EMO switch : 1ea

-. Main controller : PLC

-. Precut mounting ccuracy: +/-1 mm

-. Chuck temp : 80℃ +/-5

-. Bond roller pressure adjustable : 0~80

   kg(by air regulator).

-. Tape separation : by air blow function

-. Tape tension controller

-. Operation method : by manual

-. Noise level : 80 dB