-. Application wafer : 6”,8” or 8”,
12”
-. Wafer thickness : 200um <=
(8”)
330um
<=
(12”)
-. Wafer warpage : 4mm>=
-. Tape wide : 300mm, 400mm
-. Application tape : normal & uvtape
-. UPH : 40 wafer/hr(12”)
45 wafer/hr(8”)
-. Main controller : PLC
-. Data & GUI : PC
-.
Blade life time : 10,000 sheets
-.
Ring frame stack : 100ea
-.
Wafer center accuracy : +/-0.5mm
-.
Pre-cut tape accuracy : +/-2mm
-.
Chuck temp : 80℃ +/-5
-.
Tapeconsumption
: 30~40mm
-.
Chuck surface cleaning function
-.
Wafer angle : 0′, 90’, 180’, 270’
-.
Tape tension controller
-.
Removal tape & heat seal used
-.
Porous remove chuck
-.
UV irradiation speciation ;
1) 365 nm wave
2) high pressure mercury lamp
3) 100~1000 mj/㎠
dosage
4) lamp life time 1000 hr
5) ring blower |