TAPE MOUNT M/C
Fully auto wafer mounter & detaper
CUMDA-080 / CUMDA-120
Fully auto wafer mounter & detaper which peels off the frontside protection tape, after thinned wafer has been attached to a dicing ring frame

-. Application wafer : 6”,8” or 8”, 12”

-. Wafer thickness : 200um <= (8”)

                          330um <= (12”)

-. Wafer warpage : 4mm>=

-. Tape wide : 300mm,  400mm

-. Application tape : normal & uvtape

-. UPH : 40 wafer/hr(12”) 

           45 wafer/hr(8”)

-. Main controller : PLC

-. Data & GUI : PC

-. Blade life time : 10,000 sheets

-. Ring frame stack : 100ea

-. Wafer center accuracy : +/-0.5mm

-. Pre-cut tape accuracy : +/-2mm

-. Chuck temp : 80+/-5

-. Tapeconsumption : 30~40mm

-. Chuck surface cleaning function

-. Wafer angle : 0′, 90’, 180’, 270’

-. Tape tension controller

-. Removal tape & heat seal used

-. Porous remove chuck

-. UV irradiation speciation ;

     1) 365 nm wave

     2) high pressure mercury lamp

     3) 100~1000 mj/dosage

     4) lamp life time 1000 hr

     5) ring blower