-. Application wafer : 6”,8” or 8”, 12”

-. Wafer thickness : 200um <= (8”)

                          330um <= (12”)

-. Wafer warpage : 4mm>=

-. Tape wide : 300mm,  400mm

-. Application tape : normal & uvtape

-. UPH : 40~50 wafer/hr(8”,12”)

-. Main controller : PLC

-. Data & GUI : PC

-. Blade life time : 10,000 sheets

-. Chuck temp :80℃ +/-5

-. Wafer angle : 0′, 90’, 180’, 270’