TAPE MOUNT M/C
Semi auto wafer mounter
CUWMS-080 / CUWMS-120
Semi-auto wafer mounter that mounts wafer onto dicing tape once the operator supplies The wafer and ring frame by hand

-. Application wafer : 6”,8” or 8”, 12”

-. Wafer thickness : 200um <= (8”)

                          330um <= (12”)

-. Wafer warpage : 4mm>=

-. Tape wide : 300mm,  400mm

-. Application tape : normal & uvtape

-. UPH : 40~50 wafer/hr(8”,12”)

-. Main controller : PLC

-. Data & GUI : PC

-. Blade life time : 10,000 sheets

-. Chuck temp : 80+/-5

-. Tapeconsumption : 30~40mm

-. Wafer angle : 0′, 90’, 180’, 270’