-. Application wafer : 6”,8” or 8”, 12”

-. Application tape : normal & uvtape

-. UPH : 40 wafer/hr(12”) 

           45 wafer/hr(8”)

    [based on remove speed 50mm/s UV time 5 sec]

-. Main controller : PLC

-. Data & GUI : PC

-. Wafer center accuracy : +/-0.5mm

-. Chuck temp : 60℃ +/-5

-. Peel bar angle adjustable

-. Chuck surface cleaning function

-. Tape tension controller

-. Removal tape

-. Porous remove chuck

-. UV irradiation speciation ;

     1) 365 nm wave

     2) high pressure mercury lamp

     3) 100~1000 mj/㎠ dosage

     4) lamp life time 1000 hr

     5) ring blower

     6) UV sensor