TAPE LAMINATION M/C
Semi auto BG tape lamination
CUWLS-080 / CUWLS-120
This lamination semi-automates the application of protection tape on the surface
of the semiconductor wafer during back grinding

-. Application wafer : 6”,8” or 8”, 12”

-. Application tape : normal & uvtape

-. UPH : 55 wafer/hr(12”)  60 wafer/hr(8”)

-. Main controller : PLC

-. Data & GUI : PC

-. Blade life time : 500 sheets

-. Wafer center accuracy : +/-0.5mm

-. Blade temp : 120+/-5

-. Chuck temp : 80+/-5

-. Tapeconsumption : 30~40mm

-. Wafer angle : 0′, 90’, 180’, 270’

-. Tape tension controller

-. Tape cutting angle adjustable : 70’~90’