TAPE LAMINATION M/C
Auto Dry Film lamination
CUWLS-080(V) / CUWLS-120(V)
This laminator is use to attach photo or solder resist dry film on wafer active side to make wafer pattern. (Lamination method : Vacuum chamber lamination)

-. Application wafer : 6”,8” or 8”, 12”

-. Application tape : Photo resist dry film

-. UPH : 55 wafer/hr(12”) 

           60 wafer/hr(8”)

-. Main controller : PLC

-. Data & GUI : PC

-. Blade life time : 500 sheets

-. Wafer center accuracy : +/-0.5mm

-. Blade temp : 120℃ +/-5

-. Chuck temp : 100℃ +/-5

-. Tapeconsumption : 30~40mm

-. Wafer angle : 0′, 90’, 180’, 270’

-. Tape tension controller

-. Tape cutting angle adjustable : 70’~90’

-. Tape thickness : 50um

-. Tape width :

     230mm, 250mm for 8”

     330mm for 12”