-. Application wafer : 6”,8” or 8”, 12”

-. Cutting size : 299.7mm,   199.7mm

-. Application tape : LC2850 (adwill)

-. Tape thickness : 22um,25um, 40um

-. UPH : 30 wafer/hr(8”),  25wafer/hr(12”) 

-. Main controller : PLC

-. Data & GUI : PC

-. Core life time : 60,000 sheets

-. Chuck temp : 100℃ +/-5

-. Bond roller temp : 80℃

-. Chuck positioning by vision system

-. Core type tape cutting

-. Protect tape auto detaping(removal tape)

-. Wafer cleaning function

-. Cooling chuck installed

-. Wafer center accuracy : +/-0.5mm

-. Tapeconsumption : 30~40mm

-. Tape tension controller