Creating Values Though Innovation Solutions
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TAPE REMOVE SYSTEM
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Auto Wafer Remover(Wafer type) CUWRA-080 / CUWRA-120READ MOREThis wafer remover system automates the removal of the protection tape after back grinding.
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Auto Wafer Remover(Frame type) CURRA-080 / CURRA-120READ MOREThis wafer remover system automates the removal of the protection tape after mounted wafer.
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Auto Wafer & Frame Remover CUFRA-080/CUFRA-120READ MOREThis wafer remover system automates the removal of the dicing tape after mounted wafer.
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Auto Carrier Debonder System CUCDA-300/CUCDA-600READ MOREThis system is used to separate Metal carrier and Molded wafer after molding process.
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Auto PCB Detaper System CUPRA-120D / CUPRA-120READ MOREThe Remover system is a machine that removes tape attached to the PCB & Lead frame.