Creating Values Though Innovation Solutions
The briefing saves busy executives and researchers hours of reading time by selecting only the very best,
most pertinent information and presenting it in a condensed and easy-to-digest format.
TAPE LAMINATION SYSTEM
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Auto BG Lamination CUWLA-121(8, 12inch)READ MOREThis lamination automates the application of protection tape on the surface of the semiconductor wafer during back grinding.
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Auto BG Lamination CUWLA-120(8, 12inch)READ MOREThis lamination automates the application of protection tape on the surface of the semiconductor wafer during back grinding.
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Auto BG Lamination CUWLA-080(6, 8INCH)READ MOREThis lamination automates the application of protection tape on the surface of the semiconductor wafer during back grinding.
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Auto LC Tape Lamination CULCA-080 / CULCA-120READ MOREFully auto LC tape lamination which laminates LC tape to wafer backside after back grinding
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Auto Dry Film Lamination CUWLS-080(V) / CUWLS-120(V)READ MOREThis laminator is use to attach photo or solder resist dry film on wafer active side to make wafer pattern. (Lamination method : Vacuum chamber lamination)
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Auto Metal Carrier Lamination CUCLA-120 / CUCLA-600READ MOREAuto carrier lamination system is designed to laminate thermal seal tape to metal carrier surface automatically for chip re-distribution of FOWLP Process.
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Auto PCB Lamination CUPLA-120, CUPLA-120DREAD MOREThis lamination equipment automatically attaches tape to PCB or Lead Frame with precision.
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Auto Ring Frame Lamination CURMA-120/CURMA-080READ MOREThis equipment is used to attach tape to ring frame or square frame.
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Semi auto BG Tape Lamination CUWLS-080 / CUWLS-120READ MOREThis lamination semi-automates the application of protection tape on the surface of the semiconductor wafer during back grinding