Creating Values Though Innovation Solutions
The briefing saves busy executives and researchers hours of reading time by selecting only the very best,
most pertinent information and presenting it in a condensed and easy-to-digest format.
TAPE LAMINATION SYSTEM
Auto BG Lamination
CUWLA-121(8, 12inch)
This lamination automates the application of protection tape on the surface of the semiconductor wafer during back grinding.
Specification
| Application wafer | 8inch & 12inch |
|---|---|
| Application tape | Normal & UV tape |
| Application Wafer cassette | FOSB, FOUP, open cassette |
| Main controller | PLC & PC |
| Blade life time | 500 sheets |
| Chuck temp | Max. 80℃ |
| Bond roller temp | Max. 80℃ |
| Cutter blade temp | Max. 120℃ |
| Tape cutting angle adjustable | |
| Tape width | 8inch : 230mm, 12inch : 330mm |
Features
- Tape low tension function
- Cutter blade cleaning function
- Chuck table cleaning function
- Chuck cooling function
- Capable of silicon wafer / compound mold wafer / Carrier / PCB
Options
- FOUP wafer cassette loader (With RFID reader)
- OHT/AGV Support (E84 Spec)
- Auto communication (SECS/GEM interface)
- Auto recipe selection (by hand scanner)
- Ulpa Hepa filter
- CCD Camera (4 channel)/Black box
- Wafer ID or 2D reader
- Semi S2 Certificate
- CE Certificate