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TAPE LAMINATION SYSTEM
Auto BG Lamination
CUWLA-080(6, 8INCH)
This lamination automates the application of protection tape on the surface of the semiconductor wafer during back grinding.
Specification
| Application wafer | 6inch & 8inch |
|---|---|
| Application tape | Normal & UV tape |
| Application Wafer cassette | FOSB, FOUP, open cassette |
| Main controller | PLC & PC |
| Blade life time | 500 sheets |
| Chuck temp | Max. 80℃ |
| Bond roller temp | Max. 80℃ |
| Cutter blade temp | Max. 120℃ |
| Tape cutting angle adjustable | 70’~90’ |
| Tape width | 6inch : 180mm, 8inch : 230mm |
Features
- Tape low tension function
- Warped wafer handling function
- Chuck table cleaning function
- Chuck/Tape cooling function
- Capable of silicon wafer / compound mold wafer / Carrier / PCB
Options
- FOUP wafer cassette loader (With RFID reader)
- OHT/AGV Support (E84 Spec)
- Auto communication (SECS/GEM interface)
- Auto recipe selection (by hand scanner)
- Ulpa Hepa filter
- CCD Camera (4 channel)/Black box
- Wafer ID or 2D reader
- Semi S2 Certificate
- CE Certificate