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TAPE LAMINATION SYSTEM
Auto LC Tape Lamination
CULCA-080 / CULCA-120
Fully auto LC tape lamination which laminates LC tape to wafer backside after back grinding
Specification
| Application wafer | 6 & 8inch or 8 & 12inch |
|---|---|
| Application tape | LC2850 (adwill) |
| Tape thickness | 22um,25um, 40um |
| Main controller | PLC & PC |
| Chuck temp | Max. 100℃ |
| Blade temp | Max. 80℃ |
| Chuck cutting method | Tape Batch cutting (Pre-cut) |
| Cutting size | 12inch : 299.5mm, 8inch : 199.5mm |
Features
- Protect tape auto detaping(removal tape)
- Tape vision align system
- Cooling chuck installed
- Warped wafer handling function
Options
- FOUP wafer cassette loader (With RFID reader)
- Auto communication (SECS/GEM interface)
- Auto recipe selection (by hand scanner)
- Ulpa Hepa filter
- CCD Camera (4 channel)/Black box
- Wafer ID or 2D reader(Top or Bottom)
- OHT/AGV Support (E84 Spec)
- Semi S2 Certificate
- CE Certificate