Creating Values Though Innovation Solutions
The briefing saves busy executives and researchers hours of reading time by selecting only the very best,
most pertinent information and presenting it in a condensed and easy-to-digest format.
TAPE LAMINATION SYSTEM
Auto Dry Film Lamination
CUWLS-080(V) / CUWLS-120(V)
This laminator is use to attach photo or solder resist dry film on wafer active side to make wafer pattern. (Lamination method : Vacuum chamber lamination)
Specification
| Application wafer | 6 & 8inch or 8 & 12inch |
|---|---|
| Application tape | Photo resist dry film |
| Main controller | PLC & PC |
| Blade life time | 500 sheets |
| Chuck temp | Max. 120℃ |
| Chuck temp | Max. 100℃ |
| Tape cutting angle adjustable | 70’~90’ |
| Tape thickness | 50um |
| Tape width | 8inch : 230mm, 12inch : 330mm |
Options
- Auto communication (SECS/GEM interface)
- Auto recipe selection (by hand scanner)
- Ulpa Hepa filter
- CCD Camera (4 channel)/Black box
- Wafer ID or 2D reader(Top or Bottom)