Creating Values Though Innovation Solutions
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TAPE LAMINATION SYSTEM
Semi auto BG Tape Lamination
CUWLS-080 / CUWLS-120
This lamination semi-automates the application of protection tape on the surface of the semiconductor wafer during back grinding
Specification
| Application wafer | 6 & 8inch or 8 & 12inch |
|---|---|
| Application tape | Normal & UV tape |
| Main controller | PLC & PC |
| Blade life time | 500 sheets |
| Chuck temp | Max. 80℃ |
| Bond roller temp | Max. 80℃ |
| Cutter blade temp | Max. 120℃ |
| Tape cutting angle adjustable | 70’~90’ |
| Tape width | 8inch : 230mm, 12inch : 330mm |